Microelectronics
We Make the Impossible, Possible.
Since 2008, Forgione Engineering has delivered your requirements with more attention, innovation, and responsiveness than larger firms.
We specialize in all of your Microelectronics needs: from surgically removing components or bad traces in microscopic areas with our microtools, to detecting Foreign Object Debris (FOD), resin bleedout, defects, and other sources of contamination on your highly sensitive, valuable electronics boards with our Universal Multi-Spectral Fluorescence Device (UMFD) that provides 460nm Blue, 385nm UV, and White Light.
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What We Provide:
Universal Multi-Spectrum Fluorescence Device (UMFD)
Electrostatic Dissipative Packaging
Micro Tools
Microscope Mounted Fume Extractor
Ceramic Porous Vacuum Chuck Plate
Custom Waffle Packs
Custom Housing
Custom Microscopes
Vacuum Pick-Up Tools
Featured Catalog Sneak Peak
Universal Multispectral Fluorescence Device (UMFD)
The UMFD is an elegant solution to a multi-industry problem. Add a self-contained fluorescence accessory to your existing stereo microscope inspection process to see things beyond the visible and provide the quality that your clients expect.
High reliability manufacturers in the microelectronics or circuit board industry, industrial inspectors using penetrating oils to look for cracks in materials, educational institutions and students as well as life-science and forensics professionals can all gain tremendous insight into their work with this turn key system.
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Features:
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• 460nm Blue, 385nm UV, and White light
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• Best in class FOD detection
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• Integrated dimmable white light, UV light
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• Hands free switching operation
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• Installs in seconds
PROBLEM
Resin bleedout in microelectronics assemblies leading to potential bonding failures, as well as unreliable methods of finding FOD in assemblies, while still maintaining full working ability under magnification, and white light.
SOLUTION
The UMFD combines 460nm Blue, 385nm UV, and White light, with handfree switching and cut filter activation, allowing for efficient use in factories, on any stereo microscope
PROJECT METRICS
Increased throughput and inspection capabilities, cleaning modules, better pre-cap
Electrostatic Dissipative Packaging
Features:
- • Permanent Class Zero ESD tray
- • Tight fitting in ESD Box for reusability, can last thousands of uses
- • Part number molded into tray
- • Custom cavities for any application available
- • Ready to use or ship turn-key box that’s closed, labeled, and more
PROBLEM
Microwave modules or other assemblies move from station to station, factory to factory until complete, sometimes requiring rework and then return back to earlier stations. Every time an assembly moves, is picked up, or worked on, it can be damaged
SOLUTION
Standardized, turn-key packaging specific to product allows for Class Zero ESD protection throughout the entire process, nearly guaranteeing lower damage rates. Forgione designs and vacuum thermoforms in-house. Low MOQs, quick turn, and full production volumes available
PROJECT METRICS
Increased ramp rates in high production factories, reduction of damage, high throughput and product shipped
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